Wire Bonders

4522 Multi Process Analog Ball Bonder

For process development, production, research or added manufacturing support, MPP's 4500 Series Manual Ball Bonding Systems provide the high yields and excellent repeatability needed for every gold ball bonding application, including:

  • Optoelectronic Modules
  • Hybrid/MCMs
  • Microwave Products
  • Discrete Devices/Lasers
  • Chip-on-Board







Analog Bonder (4522)                    Digital Bonder (4524AD) - Obsolete


Function Comparison Model 4522
Model 4524AD
(Digital) - Obsolete**
Modes of Operation
Full Manual Mode (Manual Z Control & Manual X-Y Positioning)
Semi-automatic Z Mode (Semi-automatic Z control and Manual X-Y)  √  √ 
Semi-automatic Z and Auto-Stepback Mode   √  
Auto Second Bond Mode (including Stepback)     √
 Multi-Process Capability*
Ball Bonding, Bumping, Coining, Security Bonding, TAB
 √ √ 
 Motorized Y Axis and Auto-Stepback
for controlled, highly repeatable wire length and loop formation




**Model 4524AD - Technical support is still available


https://www.youtube.com/watch?v=JINvirulCnw https://www.linkedin.com/company/1202216?trk=tyah&trkInfo=clickedVertical%3Acompany%2CclickedEntityId%3A1202216%2Cidx%3A1-1-1%2CtarId%3A1441270259292%2Ctas%3Amicro%20point


Micro Point Pro LTD.
P.O Box 332
Yokneam Elite, 2066722, Israel

 Phone numbers:

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