Wire Bonders

4526 Auto-Stepback Analog Wedge Bonder

For process development, production, research or added manufacturing support, MPP's 4500 Series Manual Wedge Bonding Systems provide the high yields and excellent repeatability needed for every wedge bonding application, including:

  • Optoelectronic Modules
  • Hybrid/MCMs
  • Microwave Products
  • Discrete Devices/Lasers
  • Chip-on-Board

 

Semi-automatic and manual operation modes, individual bond parameter control and capability to use a wide range of wire diameters enable ease of use in ball bonding, ball bumping, coining, security bonding and single-point TAB applications.

       Analog Bonder (4526)                    Digital Bonder (4523AD) - Obsolete

 

Function Comparison Model 4526
(Analog)
Model 4523AD
(Digital) - Obsolete*
Modes of Operation
Full Manual Mode (Manual Z Control & Manual X-Y Positioning)
Semi-automatic Z Mode (Semi-automatic Z control and Manual X-Y)  √  √ 
Semi-automatic Z and Auto-Stepback Mode   √
Auto Second Bond Mode (including Stepback)     √
 Motorized Y Axis and Auto-Stepback
for controlled, highly repeatable wire length and loop formation

(4526)

*Model 4523AD - Technical support is still available

Downloads

 
https://www.youtube.com/watch?v=JINvirulCnw https://www.linkedin.com/company/1202216?trk=tyah&trkInfo=clickedVertical%3Acompany%2CclickedEntityId%3A1202216%2Cidx%3A1-1-1%2CtarId%3A1441270259292%2Ctas%3Amicro%20point

CONTACT US

Micro Point Pro LTD.
P.O Box 332
Yokneam Elite, 2066722, Israel

 Phone numbers:
+972-73-2293999
+972-73-2293916
+972-73-2293923

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