Wire Bonders

XDA Extra Deep Access Option

Option for Manual Wire Bonder

The XDA Extra Deep Access Option for all MPP Manual Ball Bonders, increases Z-axis clearance from the standard .360" to .700". This is also the range of controllable Z-axis motion. This feature provides additional versatility for a wider range of optical, microwave and complex hybrid/MCM applications, with emphasis on  those that require precision ball bonding in deep cavities or tight recesses where clearance and control are essential. The XDA Extra Deep Access Option with Part No. p/n 04524-0XDA-000-00, is a factory installed option, available only on new MPP Manual Ball Bonders.

The XDA Extra Deep Access Option provides significant Z-axis clearance for a sample product and the ability to perform ball bonds deep within the recessed area of the sample.

XDA for Manual Wedge Bonder

The XDA Extra Deep Access Option for all MPP Manual Wedge Bonders, not only increases Z-axis clearance from the standard .500" to .750", but also expands the range of controllable Z-axis motion from .250" to .400". This feature provides additional versatility for a wider range of optical, microwave and complex hybrid/MCM applications, especially those that require precision wedge bonding in deep cavities or tight recesses where clearance and control are essential.

The XDA Extra Deep Access Option (p/n 04523-0XDA-000-00) is a factory-installed option, available only on new MPP Manual Wedge Bonders.

Downloads

 
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CONTACT US

Micro Point Pro LTD.
P.O Box 332
Yokneam Elite, 2066722, Israel

 Phone numbers:
+972-73-2293999
+972-73-2293916
+972-73-2293923

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