Die  Bonding Tools

Die Bonding Tools

The Die Bonding process takes place prior to wire bonding. The selected die is placed in a package and mechanically connected using either eutectic or adhesive die attach methods.

Die collets are used when the process requires high accuracy for the positioning of the die. They allow for minimal contact between the die and the attachment tool and provide a strong grip, especially in the eutectic die bonding.

The Flat Face Pick Up tool is used in a Thermo-compression or Epoxy Die Attach process for picking up, holding, transferring and placing a die on the substrate.

Micro Point Pro offers a wide selection of Vacuum Pick Up tools for various applications,  manufactured from a wide range of materials and custom designed for your unique assembly process. Our tools are suitable for use with all common die bonding machine models.

Related Documents
Die Bonding.pdf
 
https://www.youtube.com/watch?v=JINvirulCnw https://www.linkedin.com/company/1202216?trk=tyah&trkInfo=clickedVertical%3Acompany%2CclickedEntityId%3A1202216%2Cidx%3A1-1-1%2CtarId%3A1441270259292%2Ctas%3Amicro%20point

CONTACT US

Micro Point Pro LTD.
P.O Box 332
Yokneam Elite, 2066722, Israel

 Phone numbers:
+972-73-2293999
+972-73-2293916
+972-73-2293923

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