Wedge Bonding Tools

Wedge Bonding Tools

  • Traditionally Wedge Bonding was used as the preferred process for wire bonding applications that use aluminum wire. Today, it is becoming the process of choice for interconnect methods such TAB, FLIP Chip and others.
  • Wedge Bonding remains the choice for Wire Bonding process and applications that use aluminum wire.
  • MPP develops and manufactures a broad range of Wedge Bonding tools from a variety of carbide materials. The most popular tungsten carbide tools are used for aluminum wire applications while titanium carbide tools are suitable for gold wire Wedge Bonding.
 
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CONTACT US

Micro Point Pro LTD.
P.O Box 332
Yokneam Elite, 2066722, Israel

 Phone numbers:
+972-73-2293999
+972-73-2293916
+972-73-2293923

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