Ball Soldering

Ball Soldering

The Hard Disk Drive (HDD) assembly process uses a variety of tool types and materials:

Capillaries, Wedges, TAB Tools and Dispensers.

Solder Jet Bonding (SJB) is now the standard technology to support HDD requirements.

Beside the common HDD applications, the Solder Jet process is also common for the following applications:

  • Hard Disk Drive Assembly (HGA, HAS, Hook-Up)
  • BGA / cLCC Balling
  • Camera Modules (VCM)
  • Wafer Bumbling and CSP Bumping

 Technological edge design and proven capability to handle high dimensional accuracy, inner surface roughness and accurate inner geometry, along with competitive pricing, make MPP the leading supplier for SJB tools.

 
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CONTACT US

Micro Point Pro LTD.
P.O Box 332
Yokneam Elite, 2066722, Israel

 Phone numbers:
+972-73-2293999
+972-73-2293916
+972-73-2293923

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