Wire Bonders

iBond5000-HWW Bonder

The iBond5000-HWW (Heavy Wire Wedge) is an advanced wedge bonder used for process development, production, research or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application.

Used for Auto and Solar advanced devices.

Features

  • 7” TFT Touch Screen Management
  • Cortex A9 Dual-Core CPU-based hardware system
  • Windows CE-based management software
  • USB connectivity - External Mouse, Keyboard, Disk on Key
  • Internal 256MB memorey Load/Store wire bonding profiles, Disk on Key backup
  • On-Line Manual
  • Designed for wire, 4 mil to 20 mil
  • Large 5.3” X 5.3” bonding area
  • Consistent tail length with fine adjustment on panel
  • Z-axis DC servo motion with closed loop control
  • Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer
  • Chessman/Mouse & Manual Z convertible left or right
  • Ultrasonic system 0-50 w

Downloads

 
https://www.youtube.com/watch?v=JINvirulCnw https://www.linkedin.com/company/1202216?trk=tyah&trkInfo=clickedVertical%3Acompany%2CclickedEntityId%3A1202216%2Cidx%3A1-1-1%2CtarId%3A1441270259292%2Ctas%3Amicro%20point

CONTACT US

Micro Point Pro LTD.
P.O Box 332
Yokneam Elite, 2066722, Israel

 Phone numbers:
+972-73-2293999
+972-73-2293916
+972-73-2293923

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